• Yante Scott Ply Bond Testing Device
  • Yante Scott Ply Bond Testing Device
  • Yante Scott Ply Bond Testing Device
  • Yante Scott Ply Bond Testing Device
  • Yante Scott Ply Bond Testing Device
  • Yante Scott Ply Bond Testing Device

Yante Scott Ply Bond Testing Device

After-sales Service: Available
Warranty: 1 Year
Load Way: Electronic Load
Display: Digital
Control: Computer Control
Power Source: AC220V
Samples:
US$ 6000/Piece 1 Piece(Min.Order)
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Customization:

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Basic Info.

Model NO.
YT-IBT
Transport Package
Wooden Box
Trademark
YANTE
Origin
China
HS Code
9024800000

Product Description

Yante Scott Ply Bond Testing Device
The interlayer bonding strength refers to the ability of the cardboard to resist the separation between layers, and is a reflection of the internal bonding ability of the paper, which is very important for the processing of multi-layer paper and cardboard. Low internal bonding value or uneven distribution may cause problems when paper and cardboard are laid flat in offset printing presses using viscous ink; too high bonding strength value will cause difficulty in processing and increase production costs.




Application Range

Box board, white board, gray board, white cardboard
Yante Scott Ply Bond Testing Device



Product Features

The non-damped encoder reduces the friction of the bearing and improves the measurement accuracy.
ARM processor, 7-inch color touch screen, Chinese menu, simple and convenient operation.
It can store 16000 sets of batch data, which is convenient for users to check historical measurement data.
The sample preparation and test are separated, and the sample preparation adopts pneumatic pressure. Compared with ordinary hydraulic paper samplers, no maintenance such as oil injection is required.
Communication with computer software (purchase separately)




Executive Standard

GB/T26203-2010



Supporting Accessories And Consumable
 

No. Accessory name Model Picture Standard Optional
1 Sample Preparation Machine YT-IBS Yante Scott Ply Bond Testing Device    
2 Internal Bond Sample Cutter YT-Q25 Yante Scott Ply Bond Testing Device     
3 Internal Bond Sample Cutter YT-CQ25 Yante Scott Ply Bond Testing Device  
 


Technical Parameters
 
No. Parameter item Technical index
1 Power Supply AC(100~240)V,(50/60)Hz 50W
2 Working Environment Temperature(10~35)ºC, Humidity≤ 85%
3 Display                   7 inch color touch screen                  
4 Specimen size 25.4mm*25.4mm
5 Specimen holding force 0~60kg/cm²(Adjustable)
6 Impact angle 90°
7 Resolution 0.1J/m²
8 Measuring range A:(20~500)J/ m² B:(500~1000)J/ m²
9 Indication error A:±1J/ m²    B:±2J/ m²
10 Unit J/m²
11 Data storage Can store 16000 batch data; up to 20 test data under each batch
12 Print Built-in thermal printer
13 Communication Interface RS232(Default) (USB, WIFI optional)
14 Dimension 460×310×515 mm
15 Net Weight 25kg around
Yante Scott Ply Bond Testing Device
 

Yante Scott Ply Bond Testing Device

 

 

Yante Scott Ply Bond Testing Device

 

 

Yante Scott Ply Bond Testing Device

 

 

Yante Scott Ply Bond Testing Device

 

 
 

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